LAMINATE
​Epoxy boards can be used as reinforcement boards and cell phone jackets. The reinforcement board mainly solves the flexibility of the flexible circuit board. As for the mobile phone shell, it uses a kind of opalescent light epoxy board, which has beautiful appearance, smooth appearance, high temperature resistance, corrosion resistance, good insulation performance, high strength, good toughness, and can protect the mobile phone from external force. Well-known brands such as Samsung and Apple phones and tablets come with such protective jackets.

Product Detail

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Epoxy boards can be used as reinforcement boards and cell phone jackets. The reinforcement board mainly solves the flexibility of the flexible circuit board. As for the mobile phone shell, it uses a kind of opalescent light epoxy board, which has beautiful appearance, smooth appearance, high temperature resistance, corrosion resistance, good insulation performance, high strength, good toughness, and can protect the mobile phone from external force. Well-known brands such as Samsung and Apple phones and tablets come with such protective jackets.


Characteristics of epoxy plate

1, strong adhesion. The existence of intrinsic polar hydroxyl and ether bonds in the molecular chain of epoxy resin makes it have high adhesion to various substances. Epoxy resins have low shrinkage when cured, resulting in low internal stress, which also helps to improve adhesion strength.

2. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.

3, easy to cure. With the selection of various curing agents, the epoxy resin system can be cured almost in the temperature range of 0 ~ 180℃. Low contractility. The reaction of the epoxy resin with the hardener is carried out by direct addition or ring-opening polymerization of the epoxy group in the resin molecule without the release of water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage during curing (less than 2%).

4. Various forms. A variety of resin, hardener and modifier systems can be adapted to almost any application form requirements, ranging from very low viscosity to high melting point solids.


ITEMS


Unit

3240

NEMA G10

NEMAFR4

NEMA G11

NEMA FR5

Thermal endurance

--

ºC

130 ( B)

130 ( B)

130 ( B)

155 ( F)

155 ( F)

Martin's Temp ( perpendicular )

ºC

200

200

200

175

260

Specific weight @ 20ºC


g/cm3

1.70 - 1.90

1.70 - 1.90

1.80 --20

1.70-1.90

1.70-1.90

Water absorption for 24 h


mg

1.2 mm - 18

1.5mm -- 19

1.0mm -- 18

1.5mm -- 19

1.2 mm - 18

Flexural strength(perpendicular)

23±2ºC

MPa

340

340

340

340

340

155ºC

170

170

170

170

170

Impact strength (Charpy)

KJ/m2

33

33

33

33

33

Impact strength (Izod)

KJ/m2

34

34

34

34

34

Electrical strength

KV/mm

≤3.0 mm, 10.2

≤3.0 mm, 10.2

≤3.0 mm, 10.2

≤3.0 mm, 10.2

≤3.0mm, 10.2

Breakdown voltage

KV

> 3.0mm, 35

> 3.0mm , 40

> 3.0mm, 35

> 3.0mm, 40

> 3.0mm, 35

Insulating resistances

W

5.0 X 108

5.0 X 108

5.0 X 108

5.0 X 108

5.0 X 108

Flammability


--

--

--

UL 94 V0

--

UL 94 V0

USE          


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